The equipment on sale has completed the full-line testing (PoC) of semiconductor packaging and testing plants and wafer fabs such as TSMC, ASE, Sipin, and Tongfu Microelectronics, and has formed sales.

For a long time, the development of the semiconductor industry has followed Moore’s Law. However, as terminal products have higher and higher requirements for chip miniaturization, low energy consumption, high performance, low cost, high reliability and other indicators, wafer manufacturing has become more and more precise, and gradually approaching physical limits. The level cost is also getting higher and higher, and more and more industry experts believe that Moore’s Law is invalid, and advanced packaging will promote the development of semiconductor performance in the post-Moore era.

The miniaturization of the chip means that the chip has more I/O interfaces, greater density, and higher requirements for the stability and accuracy of packaging technology and packaging equipment. Traditional packaging has been difficult to meet, and the demand for advanced packaging is increasing. The more obvious. Recently, I came into contact with “Huafeng Technology”, an advanced packaging equipment company. The company mainly focuses on the loading process of semiconductor packaging. The equipment on sale has completed semiconductor packaging and testing such as TSMC, ASE, Sipin, and Tongfu Microelectronics. Full-line testing (PoC) for factories and fabs, and sales have been formed.

In 2014, Huafeng Technology was established in Hong Kong, and set up a research and development and manufacturing center in Singapore, with its own brand (Capcon, AvantGo, etc.) and independent intellectual property rights. The main products include flip-chip advanced packaging equipment, Fan-Out fan-out wafer-level chip packaging, 2.5D/3D packaging, SIP integrated packaging, Stack-Die Memory stacked packaging, etc. Many products have been used in ASE for Qualcomm, The 5G chip production lines of Broadcom, Texas Instruments, Huawei HiSilicon, and other companies, as well as the artificial intelligence chip production line of NVIDIA.

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Wang Hongbo, the co-founder of Huafeng Technology, told us that the reason for this achievement is due to the superiority of Huafeng Technology’s products. The requirements for sex are very high, and accuracy and speed are often difficult to have at the same time. Huafeng’s advantage is that it can do all of the four.”

According to the introduction, the equipment of Huafeng Technology can achieve the same accuracy as European and Japanese equipment, the speed is 1~2 times faster, and it can achieve continuous and stable work 7×24 hours. Not only is there a certain advantage in performance, but also in product design. Huafeng TechnologyHave its own considerations.

In the semiconductor manufacturing industry, first-generation products are often fixed equipment and processes. Once the product is updated, the production line must be adjusted accordingly. The cost of semiconductor manufacturing equipment is high and replacement costs are very high.

In order to help packaging factories reduce costs and improve their own product line adaptability, Huafeng Technology’s products all adopt a unified standard platform and modular design. Such a design makes the single equipment only need to replace modules with different functions and different processes to meet the needs of production line changes. “Not only is the cost reduction, this design can also speed up the speed of downstream manufacturing companies’ production line changes.” Wang Hongbo said.

In addition, Huafeng Technology also actively cooperates with customers to explore the most advanced technology to help customers solve problems. This move also allows customers to use the company’s equipment from the start of research and development, which is more likely to create a sense of trust, and is also conducive to the subsequent sales of the company’s products and enhance the company’s competitiveness.

In terms of the market, TSMC, Samsung, Intel, ASE, Amkor, Changjiang Electronics Technology, Tongfu Microelectronics, Huatian Technology and many other factories have begun to use advanced packaging technology. The increase in demand for advanced packaging technology has driven the rapid increase in demand for advanced packaging equipment. According to data, the global advanced packaging equipment market volume is 380 million U.S. dollars in 2019, and the annual growth rate is expected to be 10%, and it will reach 673 million U.S. dollars in 2025.

But for a long time, the advanced packaging equipment market has been occupied by manufacturers such as Singapore ASMPacific, US K&S, Netherlands Besi, Japan Shinkawa, etc. With the breakthrough of domestic packaging equipment manufacturers in advanced packaging technology, the domestic production rate is expected to continue to expand.

In the second half of 2020, Huafeng Technology will begin to expand into the domestic market and has already landed a formal team. Later, it plans to set up equipment production bases in China and establish a professional sales team for Chinese customers. In the future, Huafeng Technology will continue to update and iterate its products.

In terms of the team, the founding team of Huafeng Technology has worked in a well-known semiconductor company in Singapore. In 2011, it launched the POP (Package on Package) placement machine used in Apple’s A9 chip packaging process, and has deep technical experience.