Continue to develop 3D multi-sensor fusion component solution .com / “style =” letter-spacing: 0px; “> Juxin Microelectronics ” announced the completion of 180 million yuan of Series B financing. Among them, 120 million yuan was led by Heli Capital, followed by source code capital, and 60 million yuan was jointly invested by Hushan Capital, Jiangmen Venture Capital and well-known mobile phone industry chain funds. It is reported that this round of financing will be used to expand the mass production of back-illuminated high-resolution ToF and intelligent audio products, and will also invest in the development of lidar, optical sensing and multi-sensing fusion technologies.
Juxin Microelectronics is a company that continues to pay attention and reports. Founded in January 2016, it is a company focused on high-performance analog and mixed-signal chip design and application systems. Headquartered in Wuhan, Shenzhen, Shanghai, There are R & D and sales centers in Europe and America. The company has two major product lines of optical sensing and intelligent audio, and has dozens of independent intellectual property rights.
In the field of intelligent audio products, Polychip independently developed the analog input smart audio power amplifier chip “SIA810X series”, which integrates amplitude protection, temperature protection and boost modules, and is equipped with Polychip ’s self-developed Sound IntelligenceTM Sound quality enhancement and speaker protection algorithm. “The chip can intelligently adjust the state of the speaker according to the audio characteristics, provide a better listening experience, and extend the life of the speaker.” Liu Deheng, founder and CEO of Juxin Microelectronics, said, “This chip solution is compatible with mainstream audio amplifiers on the market The product can also meet the software system integration requirements of Qualcomm and MTK platforms. “
It is reported that this audio solution has been recognized by the industry’s first-line mobile phone manufacturers for its excellent performance and reliability, and has served tens of millions of first-line brand smartphones.
In the field of optical sensor chips, Juxin mainly develops ToF sensor chips and 3D vision solutions, and has already developed mature products. In March 2020, Juxin released a back-illuminated, high-resolution ToF sensor chip with independent intellectual property rights. It is widely used in scenarios with high-performance 3D sensing and imaging requirements such as smart phones, face recognition, and machine vision.
Once introduced, ToF (Time-of-Flight time-of-flight), the mainstream 3D vision technology, mainly calculates the distance between an object and a light source by calculating the reflection time difference of near-infrared light to form a stereo vision. Compared to structureOptical and binocular technology, ToF technology has the advantages of excellent system cost, simple and stable structure, long measuring distance, and more suitable for outdoor scenes. It is favored by users in mobile phones, industrial and automotive industries.
In recent years, ToF technology is gradually being applied to consumer electronics. Many smartphone manufacturers have chosen to use ToF cameras in their flagship phones. For example, Huawei Mate 30 Pro, vivo NEX and other dozens of hands have used ToF technology. According to relevant media reports, iPhone 12 will also bring a ToF (distance measurement) camera on the back. Yole predicts that by 2020, 173 million smartphones with ToF capabilities will be shipped worldwide. In April 2020, Apple released the new iPad Pro. This new model is equipped with a ToF technology “lens”, which opens up new possibilities for augmented reality (AR) and a wider field.
Liu Deheng told us that the AR world starts with the three-dimensional reconstruction of the real environment, and Juxin is also deeply laying out the 3D perception field. He said: “We will continue to target the field of consumer electronics, actively participate in the most cutting-edge international scientific and technological competition, and advance through the accumulation of 3D vision, 3D audio and tactile perception The landing and development of multi-sense fusion technology. ”
As the lead investor in this round, Tang Zhihua, a partner of Heli Capital, said: “3D vision and perception is a highly promising and explosive circuit. Both technological innovation and market structure are rapidly evolving. There is huge room for growth. Juxin is backed by the decades of European production, research and development, and the domestic excellent management and management team will surely allow technology to take root and blossom. Heli Capital has rich experience in semiconductor industrialization and industry Resources will fully empower Juxin in key links of the foundry, packaging, testing and other industrial chains. “
Source capital Zhang Xingchen said: “3D sensor chips and modules represented by ToF are becoming a new generation of technological infrastructure. This is the first investment of source capital in the field of chips. We see 3D from the application layer Perceive the broad market space in the field and devote to deep linking the content and upstream technology. Unlike traditional chip design companies, Juxin has the ability to define and differentiate hardware through software algorithms, which will promote them to stand out in this field. Make some achievements. “
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