The performance of the RF front-end needs to be further improved.

It is learned that 5G RF front-end chip company “ Xinpu Technology ” has recently announced the completion of tens of millions of RMB Pre -A round of financing. This round of financing was led by Hua Chuang Capital, followed by Northern Light Venture Capital and China Science and Technology Venture Capital. The funds will be mainly used for team building, rapid chip R & D and iteration, and market expansion. It will provide first-class RF front-end modules in mobile phones and the Internet of Things.

Xinpu Technology Co., Ltd. was established in late 2018 and is headquartered in Shanghai. It has a complete mobile RF front-end R & D team. Its R & D capabilities cover various fields such as GaAs, RF SOI, CMOS Analog and Digital. It mainly provides electronics, computer technology, software Technology development and transfer in the technical field, R & D of integrated circuits, manufacturing and sales of chips and semiconductor components, and related technical consulting services. The Chippu team has worked in well-known RF PA companies in the industry, and has researched, developed and mass-produced industry-leading products in the era of 2G / 3G / 4G mobile phones.

The following is a report on Chip Technology in July 2019:

5G equipment is about to be put into commercial use. Compared with 4G, 5G not only provides ultra-high data transmission services on the user’s network experience, but also redefines the “interactive function” between the network and modem of the RF front-end to meet the future. “Internet of Everything” needs. This also means that RF component suppliers need to upgrade the performance of the original front-end modules to meet the support of the new standard (5G equipment).

At present, the challenges of 5G RF front-end module technology facing “Xinpu Technology” are mainly four points:

  • High power. At present, operators require smart mobile terminals to implement HPUE. This requires doubling the terminal’s transmit power;

  • High frequency, 5G communication requires larger frequency band space, such as the Sub-6GHz frequency band;

  • Large bandwidth, compared with the original 4G LTE 20MHz bandwidth, 5G will use a 100MHz operating bandwidth, which will require further improvement in the linearity of the RF power amplifier;

  • High density, in a very small module space, 5G RF front-end modules will integrate RF power amplifiers, RF switches, filters, couplers and other RF devices;

    Xinpu Technology will integrate decades of GaAs, RF SOI, CMOS Analog and Digital chip design experience, to meet the needs of 5G smart mobile terminal customers, to solve the problems encountered in the technical development of 5G RF front-end modules, the goal is to develop high-performance, high-quality 5G smart terminal RF front-end modules.

    In addition to technology development for 5G RF front-end modules, with the popularization of wireless technologies and products in the future, “Xinpu Technology” plans to develop products that can be widely used in the Internet of Things, automotive and other industrial fields.