The market scale of the heat dissipation industry has exceeded 100 billion
Heat dissipation is a problem that all electronic devices must consider. Without any heat dissipation treatment, the temperature of the chip running at full load will be quickly over-temperature protected, and the chip in the data center The surface temperature can reach 70-80℃ under working condition. Excessive temperature will not only affect the life of components, but also cause hardware problems such as freezing and crash of the equipment, and it will also bring more difficult maintenance work. .
I recently came into contact with a start-up company “Lanyang Technology” that provides a total solution for immersed liquid heat dissipation. The company was established in 2019. It developed the core technology of heat flow modeling, immersion in heat conduction liquid, and coating technology. An immersed liquid heat dissipation solution that can standardize the cost of air cooling. The company’s target customers are mainly manufacturers of PC, IDC, 5G base stations, mobile phones and projectors. The current products include immersed liquid heat dissipation solutions including thermal fluid and the physical structure of heat dissipation modules. In 2020, the company has cooperated with Raytheon Desktop to launch an immersed liquid cooling small desktop host
In cooperation with Raytheon Desktop, launched an immersed liquid cooling small desktop host
According to related research Statistics, the total electricity consumption of data centers nationwide in 2018 was 160.889 billion kilowatt-hours, which is equivalent to the annual power generation of the Three Gorges Dam. Among them, the operation of the refrigeration system accounts for 40% of the total energy consumption. In order to reduce the temperature of electronic components, the current mainstream solutions on the market use the physical environment to passively dissipate heat (such as reducing the temperature of the space), and use air cooling or water cooling to actively dissipate heat. For example, Facebook puts its data center close to the Swedish forest in the Arctic Circle; PC computersFans are commonly used for heat dissipation; Ali and Inspur servers both use liquid cooling solutions.
Compared with traditional heat dissipation methods, immersion liquid cooling technology has higher heat dissipation efficiency, but the cost is relatively higher. “This is also the reason why immersion liquid cooling technology has not been quickly popularized. The cost balance is still being explored.” Lanyang Technology co-founder Mo Jingjie told, “At present, Lanyang’s immersed liquid cooling technology can increase the heat dissipation efficiency by at least 6 times compared with traditional air cooling, but it can be done in price. To the level of application on the consumer side.”
Dismantling the immersion liquid cooling technology, its core includes the performance of the heat transfer liquid, and the targeted immersion liquid cooling scheme design for different scenarios.
Specifically, the immersion heat transfer liquid used by Lanyang Technology has the characteristics of low corrosion, low viscosity, high chemical stability, high insulation, high liquid flow, high heat conductivity, non-toxic and tasteless, etc. No need to replace in 18-25 years. “At present, most of the immersion liquid heat dissipation materials on the market use fluorinated liquids. This type of liquid has certain toxicity and needs to be used when working.Boiling< /a>, so the noise is loud. In addition, its cost is very high, the heat dissipation effect is unstable, the volume is relatively large, and it cannot be used for civilian use.” Mo Jingjie said.
In terms of specific plan design, Lanyang Technology CTO Lin Zijie told that after receiving the demand, we will establish different heat flow models according to different heat dissipation requirements, calculate the thermal conductivity, and then prepare the immersion heat transfer fluid according to the heat transfer requirements. Design the corresponding hot runner and cooling module.
“The most intuitive judgment. For example, the heat dissipation and speed of mobile phones and PCs are less than large transformers, IDCs, and 5G base stations, so the solutions given for different scenarios They are different, but the requirements of similar scenes are basically the same.” Lin Zijie said.
It is reported that Lanyang Technology’s heat flow modeling is a discrete element structure model based on the heat conduction of particulate materials, starting from the material properties of solids and liquids on the contact surface, and using particles to treat solids in contact with fluidsThe surface structure improves the thermal conductivity between the heat conducting liquid and the outermost solid material. Based on the properties of the material itself, the thermal conductivity of the model obtained by the model analysis is 33%-48% higher than the value obtained by connecting solid-liquid materials in the traditional way, and the actual increase in thermal conductivity is about 35%.
Take the desktop host jointly launched by Lanyang Technology and Raytheon Desktop as an example. In addition to immersing in thermal fluid, Lanyang Technology has also added a number of small turbines inside the fluid chamber of the chassis to further improve the thermal conductivity. A heat dissipation module is added to the outside to allow the liquid to flow back into the cavity through the conduit to form a heat dissipation closed loop, which achieves the maximum heat exchange efficiency with the chip. In effect, under the extreme environment of a top-level hardware dual-baking machine at a room temperature of 28°C, the temperature difference between the CPU and GPU operating temperature of the host and the room temperature can be controlled within 50°C to reach the optimal temperature of the chip.
In addition to solutions in the consumer electronics field (such as PCs, mobile phones, projectors, etc.), Lanyang Technology is also developing solutions for large-scale heat dissipation scenarios such as data centers, 5G base stations, lidars, and power grid base stations, and plans to start with the Internet The company’s data center has begun to advance and has now received support from several partners.
There are many downstream applications in the heat dissipation industry, according to the forecast of the Foresight Industry Research Institute , the market space is at the level of 100 billion yuan. The compound annual growth rate of the heat dissipation industry from 2018 to 2023 will reach 8%. The market size will increase from 149.7 billion yuan in 2018 to 219.9 billion yuan in 2023. In the field of heat dissipation materials, China Stone Technology, Carbon Yuan Technology, Shuanghong, Chaozhong, Jiance Waiting for listed companies.
Now with the advent of the 5G era, the power consumption of 5G mobile phones is more than twice that of 4G mobile phones, and the demand for heat dissipation in the field of consumer electronics has increased significantly. From 2016 to 2020, the compound annual growth rate of the smartphone radiator component market reached 26.1%, and the market size in 2020 will reach US$3.6 billion.
With air coolingDifferent heat dissipation methods, such as immersed liquid heat dissipation, do not need to invest in external refrigeration equipment, which can greatly save space and energy, and at the same time avoid the risk of components due to external factors such as dust. Currently, major technology companies including Ali, Google, and Microsoft Researching the solution of liquid heat dissipation.
As for the team, the founding team of Lanyang Technology is composed of a number of PhDs in engineering from Japan overseas. It is reported that Lanyang Technology has obtained tens of millions of angel venture capital from well-known investment institutions Hongtai Fund, Rice Venture Capital, and Ningbo Angel Guidance Fund within only three months of its establishment.